Mitsuya is a precision plating company that specializes in high technology plating requirements. We have four factories located throughout Japan and also a dedicated research lab that can handle prototype requests.
Electro AuSn alloy plating
Mitsuya offers a plating deposit as a lead-free solder for parts that require high-temperature connections, and as a solder for high-strength and high-reliability connections.
The gold-tin alloy plating developed by Mitsuya can make the Au80: Sn20 composition uniform, which was previously impossible. Non-eutectic compositions of gold-tin alloys plating can be provided, too.
Gold-tin alloy plating does not heat during the process, so the wafer does not deteriorate.
Mitsuya is the first to develop gold-tin alloy plating in Japan which succeeds in reducing wafer loss costs by more than 10 million yen annually because the composition and film thickness are uniform and the variation is small, the chip can be taken to the end when the wafer is cut. Advantages of Mitsuya’s Gold-Tin Alloy Plating:
・Thin (5μm) to thick (50μｍ) platings are available.
・Uniform content at eutectic point (80wt%Au-20wt%Sn) and the other composition.
・Uniform thickness in the whole wafer.
・Plating on fine patterns is available.
・Lower cost than using Gold-Tin sheet.
Application & Properties:
・Optoelectronics and laser applications
・Good joint strength
・High melting point is compatible with subsequent reflow processes
・Pb-free and RoHS compliant
・Superior thermal conductivity
・Resistance to corrosion
・Superior thermal fatigue resistance
・Excellent meltability at 280℃
・Resistance to oxidation
・High-reliability joining and sealing
・Fluxless soldering processes
Wafer Bump Plating
Wafer bump plating from Mitsuya is used for flip chips for smartphones. Copper pillars can be formed with a pitch of up to 10 µm and a height of 100 µm.
Electroless nickel, electroless gold, palladium, tin, etc. can be formed on the upper layer of the pillar. We are able to plate on GaAs and Silicon wafer materials.
The wafer sizes available for mass production are 3" and 4", and the wafer sizes available for prototyping are 3", 4", and 8".
We offer prototyping services for various materials and wafer sizes other than those mentioned above. We will propose the best process to meet your needs.
Shinagawa ku, Tokyo 141-0031, Japan